[time-nuts] PCB design questions thread II
Matthew Smith
matt at smiffytech.com
Mon Jun 2 20:34:44 EDT 2008
Quoth Bruce Griffiths at 2008-06-03 09:50...
> How do you cope with SMT parts (eg high frequency ADCs) with metal
> thermal transfer /ground connections under the package itself?
Haven't done it myself, but interested to hear others experiences. I'm
guessing that this would be a job for solder paste and a toaster oven -
or high-tech equivalent.
--
Matthew Smith
Smiffytech - Technology Consulting & Web Application Development
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